
87
32117DS–AVR-01/12
AT32UC3C
7.9.9
MACB Characteristics
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
Note:
1. These values are based on simulation and characterization of other AVR microcontrollers manufactured in the same pro-
cess technology. These values are not covered by test limits in production.
Table 7-59.
Symbol
Parameter
Conditions
Min.
Max.
Unit
MAC1
Setup for MDIO from MDC rising
VVDD = 3.0V,
drive strength of the pads set to the
highest,
external capacitor = 10pF on MACB
pins
02.5
ns
MAC
2
Hold for MDIO from MDC rising
0
0.7
ns
MAC
3
MDIO toggling from MDC falling
0
1.1
ns
Table 7-60.
Ethernet MAC MII Specific Sig
nals(1)Symbol
Parameter
Conditions
Min.
Max.
Unit
MAC4
Setup for COL from TX_CLK rising
VVDD = 3.0V,
drive strength of the pads set to the
highest,
external capacitor = 10pF on MACB
pins
0ns
MAC5
Hold for COL from TX_CLK rising
0
ns
MAC
6
Setup for CRS from TX_CLK rising
0.5
ns
MAC7
Hold for CRS from TX_CLK rising
0.5
ns
MAC8
TX_ER toggling from TX_CLK rising
16.4
18.6
ns
MAC
9
TX_EN toggling from TX_CLK rising
14.5
15.3
ns
MAC10
TXD toggling from TX_CLK rising
13.9
18.2
ns
MAC
11
Setup for RXD from RX_CLK
1.3
ns
MAC
12
Hold for RXD from RX_CLK
1.8
ns
MAC13
Setup for RX_ER from RX_CLK
3.4
ns
MAC
14
Hold for RX_ER from RX_CLK
0
ns
MAC
15
Setup for RX_DV from RX_CLK
0.7
ns
MAC16
Hold for RX_DV from RX_CLK
1.3n
ns